Rigaku TXRF 310FAB
Automatic metal contaminant detection system using grazing incidence
The TXRF 310FAB is optimised for automatically detecting very low levels of surface metal contamination on 300 mm wafers.
A 300mm wafer can be inspected in 35 minutes with detection limits as low as 5×10-10 atoms/cm2, right up to the edge of the wafer (0 mm edge exclusion).
The robotic arm enables inspection of the rear side of the wafer.
A high-intensity rotating anode ensures maximum flow, enabling the detection of light elements (Na, Mg, Al), transition metals and heavy metals.
The SDD detector guarantees excellent energy resolution at high count rates.
For trace element detection (Na–U), the system can be combined with a VPD and TXRF, offering a unique solution on the market.
Key features
- Quick contamination inspection for semiconductor processes
- Accepts 300 mm, 200 mm, and 150 mm wafers
- Wide range of analytical elements (Na~U)
- Light-element sensitivity (for Na, Mg, and Al)
- Single target 3-beam method and XYθ stage are unique to Rigaku, enabling highly accurate ultra trace analysis over the entire wafer surface
- Import measurement coordinates from defect inspection tools for follow-up analysis
- FOUP, SMIF, and through-the-wall configurations are available to meet the various needs of high-volume manufacturing wafer fabs