Liquid Cooling Flow Through Module – nVent
Next Level Cooling Solutions for Advanced MIL computing power.
Although software is advancing rapidly, processors must remain the same size or shrink to meet SWaP requirements. As the upper threshold of board level heat and power dissipation continues to rise, it is exceeding the limits of air and conduction cooling, requiring more advanced solutions to keep boards from overheating.
nVent SCHROFF has developed a Liquid Flow Through cooling solution in accordance with VITA Standard 48.4 which will allow customers to solve their thermal challenges with a customized flow through path that transfers heat away from processors.
This provides superior heat dissipation compared to air or conduction cooling, with cooling capacity of approximately 300+ watts per 6U slot.