PELCO Tripod Polisher
PELCO Tripod Polisher 590 from Milexia: Precision TEM/SEM prep in minutes. Perfect for cross-sections in Euro labs.
PELCO Tripod Polisher 590: Master TEM/SEM Sample Prep
Milexia delivers IBM-designed precision polishing for micron-level cross-sections across European labs and beyond.
The PELCO Tripod Polisher™ 590, available from Milexia, enables precise preparation of TEM and SEM samples targeting micron-sized regions with minimal ion milling—often under 15 minutes or none at all.
Developed by IBM researchers, it excels in cross-sections and plan-view samples from semiconductors, ceramics, composites, metals, and geological materials.
Applications
- Cross-sectional analysis for SEM and TEM in semiconductor fabs and R&D labs.
- Plan-view and thinning prep for ceramics, composites, metals, and geological specimens.
- Reducing ion milling time in electron microscopy sample workflows globally.
- Precise wedge polishing for electron-transparent regions without amorphization.
Key Features of PELCO Tripod Polisher
- Three micrometer assemblies for exact plane-of-polish control during lapping and thinning.
- Slotted L-bracket for SEM stubs and Pyrex insert for wedge technique up to 1.5-2° angles.
- Compatible with diamond discs (15μm start), films (30μm to 0.5μm), and colloidal silica final polish.
- Produces large thin areas over specimens, repeatable for high-throughput prep.
- Includes hex driver set, mounting wax, case; optional inverted microscope for alignment.
¿Why choose Milexia?
Milexia integrates the PELCO Tripod Polisher into its comprehensive TEM/SEM prep lineup, partnering with leaders like Ted Pella for cutting-edge tools.
Our multi-country network offers demos, training, and swift delivery to boost lab efficiency across Europe.
Certified with EcoVadis Gold, we prioritize sustainable, high-reliability solutions for your microscopy needs.
Technical Specifications
- Models: 590TEM (TEM focus), 590SEM (SEM), 590TS (thinning/wedge).
- Micrometers: Three precision assemblies for parallel/wedge polishing control.
- Grinding: 15μm metal-bonded diamond disc initial; diamond lapping films 30μm-0.5μm.
- Final polish: Colloidal silica suspension to <1μm thickness fringes.
- Mounts: SEM stubs, single-aperture TEM grids, Pyrex wedge insert; wax adhesion.