Techno Horizon TI-X900s
High definition CT X-ray Inspection System, designed for non-destructive testing of the most advanced electronic and semiconductor components. With an exceptional resolution of up to 0.16 µm, it enables detailed analysis of internal structures in both 2D and 3D.
The TI-X900s from Techno Horizon is a very high-precision X-ray inspection system designed for non-destructive testing of the most advanced electronic and semiconductor components. With an exceptional resolution of up to 0.16 µm, it enables detailed analysis of internal structures in both 2D and 3D.
The TI-X900s is a premium X-ray inspection solution dedicated to applications requiring extreme precision.
It provides highly clear visualization of internal defects invisible to the naked eye, such as cracks, voids, defective solder joints, or complex multilayer structures.
Its advanced imaging system, combined with high-precision positioning, ensures reliable results in both production environments and research and development.
High resolution imaging
Lage work table
Key features :
- Ultra-fine resolution up to 0.16 µm
- High-precision 2D and 3D (CT) inspection
- Large inspection area up to 600 × 620 mm
- 6.8-megapixel X-ray detector
- Automatic alignment and correction functions
- Designed for demanding industrial environments