Primary TWM – AEM, Inc.

AEM, Inc. has devised an aerospace-qualified tin/lead (Sn/Pb) conversion process designed to virtually eliminate the formation of tin whiskers on surface-mount component terminations (including types with external terminals).

The AEM proprietary plating process delivers superior quality while eliminating the potential damage to sensitive electronic devices caused by conventional hot-solder dipping.

AEM’s Sn/Pb conversion process is ideal for chip scale passive components including capacitors, inductors, resistors, ferrite chip beads, fuses, resistor arrays, capacitor arrays, bead arrays and many molded body passive and active surface mount component types.