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PELCO Tripod Polisher

PELCO Tripod Polisher 590 from Milexia: Precision TEM/SEM prep in minutes. Perfect for cross-sections in Euro labs.

This product is available from Milexia Iberica

PELCO Tripod Polisher 590: Master TEM/SEM Sample Prep

Milexia delivers IBM-designed precision polishing for micron-level cross-sections across European labs and beyond.

The PELCO Tripod Polisher™ 590, available from Milexia, enables precise preparation of TEM and SEM samples targeting micron-sized regions with minimal ion milling—often under 15 minutes or none at all.

Developed by IBM researchers, it excels in cross-sections and plan-view samples from semiconductors, ceramics, composites, metals, and geological materials.

Applications

  • Cross-sectional analysis for SEM and TEM in semiconductor fabs and R&D labs.
  • Plan-view and thinning prep for ceramics, composites, metals, and geological specimens.
  • Reducing ion milling time in electron microscopy sample workflows globally.
  • Precise wedge polishing for electron-transparent regions without amorphization.

Key Features of PELCO Tripod Polisher

  • Three micrometer assemblies for exact plane-of-polish control during lapping and thinning.
  • Slotted L-bracket for SEM stubs and Pyrex insert for wedge technique up to 1.5-2° angles.
  • Compatible with diamond discs (15μm start), films (30μm to 0.5μm), and colloidal silica final polish.
  • Produces large thin areas over specimens, repeatable for high-throughput prep.
  • Includes hex driver set, mounting wax, case; optional inverted microscope for alignment.

¿Why choose Milexia?

Milexia integrates the PELCO Tripod Polisher into its comprehensive TEM/SEM prep lineup, partnering with leaders like Ted Pella for cutting-edge tools.

Our multi-country network offers demos, training, and swift delivery to boost lab efficiency across Europe.

Certified with EcoVadis Gold, we prioritize sustainable, high-reliability solutions for your microscopy needs.

Technical Specifications

  • Models: 590TEM (TEM focus), 590SEM (SEM), 590TS (thinning/wedge).
  • Micrometers: Three precision assemblies for parallel/wedge polishing control.
  • Grinding: 15μm metal-bonded diamond disc initial; diamond lapping films 30μm-0.5μm.
  • Final polish: Colloidal silica suspension to <1μm thickness fringes.
  • Mounts: SEM stubs, single-aperture TEM grids, Pyrex wedge insert; wax adhesion.

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