Custom Hybrids & ASICS
Integrated hybrids and 3D multi-chip modules
Questo prodotto è disponibile presso Milexia Italia
PDC designs highly integrated hybrids and 3D multi-chip modules containing state of the art analog, digital and mixed signal ASICs utilizing the latest packaging technologies such as:
- Flip Chip
- Ball Grid Array
- Stacked Die
- Embedded Magnetics
This level of integration enables highly compact solutions that our customers can count on for the duration of their programs. PDC custom products are delivered to the most stringent quality assurance requirements.