3D Plus – COMBO
A Space Grade Configuration Memory Boot Manager
This product is available from Milexia Iberica and Milexia Italia
The 3DCO0849 is a space grade Configuration Memory Boot manager COMBO to boot SRAM based FPGAs and MPSoCs requiring a large configuration memory.
3D Plus’s COMBO module provides a unique solution that combines all required hardware resources into a single module to boot SRAM based FPGAs with the smallest PCB footprint available in the market.
Module Configuration
- Power Supply: 1.2V, 2.5V, 3.3V
- Temperature Range: -40°C to +105°C
- High level of miniaturization : 32 x 32 mm² area, 22 g
Radiation Performances
- TID > 50 krad (Si)
- SEL LET > 62.5 MeV.cm²/mg
Supporting different SRAM FPGA types
- AMD Xilinx Versal ACAP,
- AMD Xilinx Ultrascale / Ultrascale+,
- AMD Xilinx 7 Series, 6 Series, 5 Series,
- NanoXplore NG-ULTRA, ULTRA 300.